A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University. Abstract ...

You don’t have to be a Snow Crash or Tron fan to be familiar with the 3D craze that characterized the rise of the Internet and the World Wide Web in particular. From phrases like ‘surfi… ...

Pearl, the global leader in dental AI solutions, today announced that it has received FDA 510(k) clearance for Second Opinion® 3D, making Pearl the first and ...

Indian developer BornMonkie has announced Dodo Duckie!, a 2D and 3D perspective-swapping puzzle platformer coming to PC via Steam in 2026.