Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process further allows ...

Researchers have proposed process flow guides for 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet-engine ...

AI-based motion synthesis promises to assist 3D animators by generating character motion on editable rigs ...

EXCLUSIVE: AI firm Cartwheel has emerged from closed beta, promising to help make the 3D animation process smoother and accessible to a wider range of creative workers. The company was co-founded ...