CEO Michael Plisinski highlighted that Onto Innovation ended 2025 "on a high note with orders from 2.5D packaging for AI devices more than doubling in the quarter, contributing to a record revenue of ...

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon ...

Mon, February 16, 2026 at 8:20 PM UTC Our AI Investor Podcast hosts, Eric Bleeker and Austin Smith, have been counting down 12 trends they believe AI investors will want to keep an eye on in 2026.

TAIPEI (Taiwan News) — Demand for artificial intelligence chips is accelerating growth across the semiconductor industry, ...

China on track to account for nearly half of world wafer capacity in two years, organiser of world's largest chip industry ...

Applied Materials capitalizes on AI-driven chip demand with new R&D partnerships and DRAM-based WFE innovations.

As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical ...

ASML dominates extreme ultraviolet (EUV) lithography, the technology used to manufacture the world's most advanced logic chips. Decades of R&D and a deep patent portfolio have given the Dutch ...

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a ...