Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...
Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
ALISO VIEJO, Calif.--(BUSINESS WIRE)--indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, ...
The move toward 3D ICs and heterogeneous integration overcomes limitations of 2D scaling by integrating multiple specialized ...
Adtran brings advanced integration to OIF 400ZR+ demo at ECOC 2023 News summary: Showcase of open network architecture features enhanced flexibility and 400ZR+ performance Adtran continues to champion ...
Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...
How embedded technology is advancing military operations. Why open standards are crucial to today’s electronics systems. The importance of a unified infrastructure across critical communication ...
TORONTO, Dec. 11, 2025 /PRNewswire/ - SeQent, a leading provider of industrial alarm notification and plant-floor communication software, and Wunderlich-Malec Engineering, Inc (WME), a nationally ...
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