Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

Packaging has shifted from a back-end afterthought to the center of Intel's manufacturing strategy as AI workloads push ...

This is exactly the kind of anchor customer the Intel Foundry business has been trying to land since Pat Gelsinger first ...

AVNT targets margin growth with defense demand, Dyneema capacity expansion and chip packaging tailwinds driving steady, ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces. Apple is anticipated to bring out ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...