We may look back at 2001 as the year the age of plastic flip-chip began. After hovering in a seemingly endless holding pattern, flip-chip packaging and assembly of ICs on laminate (plastic) substrates ...
Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...
Flip-chip is hot, and so are licensing and other development deals tied to the space-saving semiconductor packaging technology, which is seeing growing use in portable and other sophisticated ...
Two new materials for flip-chip assembly are available. GPC-251A/B is an electrically conductive adhesive and 123-38A/B187 is a thermally conductive underfill epoxy. Flip-chip assembly replaces wire ...
TORONTO, Dec. 17, 2020 (GLOBE NEWSWIRE) -- POET Technologies Inc. (“POET” or the “Company”) (TSX Venture: PTK; OTCQX: POETF) the designer and developer of the POET Optical Interposer™ and Photonic ...
Kyocera America, Inc. announced on F3b. 7 that it has doubled its flip-chip assembly capacity for microelectronic devices with a new $3.5 million Class 10,000 clean room, offering lead-free processes ...
Hysol FP4547FC debuts as the market's first capillary flip-chip underfill to be compatible with clean and no-clean flux residues, thereby facilitating lead-free assemblies. The product promises to ...
DUBLIN--(BUSINESS WIRE)--The "Global Flip Chip Market By Packaging Technology, By Bumping Technology, By End User, By Region, Industry Analysis and Forecast, 2020-2026" report has been added to ...
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