A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

Huawei's success in having its self-developed SoC produced with 7nm technology by SMIC, China's largest wafer foundry service provider, stunned the world. Since Huawei is unable to access EDA tools ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

The introduction of large language models into the EDA flow could significantly reduce the time, effort, and cost of designing secure chips and systems, but they also could open the door to more ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...

The demand for smaller, lighter, and more efficient AC/DC USB power delivery (PD) chargers is always a challenge for power-supply design engineers. Below 100 W, the quasi-resonant flyback is still the ...