Once upon a time, integrated circuits (ICs) were built by the same companies that designed them. The design of an IC was tightly integrated with the manufacturing processes available within each ...

IC design houses are hesitant to place orders for mature process manufacturing with foundries, due to the still uncertain market outlook for the second half of this year, according to industry sources ...

Due to the continuous expansion of China's mature process capacity and the ongoing requests from downstream customers for price reductions, the industry is very curious about the wafer pricing that IC ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

Analog and mixed-signal (AMS) circuit design typically involves designing components like amplifiers, filters and data converters, which can be complex and time-consuming, often requiring manual ...

Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...

Industry’s leading platform for creating differentiated custom silicon delivers unmatched productivity benefits with new generative AI technology Virtuoso Studio empowers designers to push ...

Verification Suite Streamlines IC Design Process Designed specifically for IC designers using hardware-assisted verification platforms, the Emulation Edge verification suite speeds the functional ...

One cannot imagine the world now and in the future without integrated circuits (IC or generally known as chips). With worldwide revenue projected to be about $500 billion by the end of 2019, the chip ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

If you want a graphic indication of how much the wall between SoC design and chip manufacturing has come down, take a look at SPIE. This conference, more formally SPIE Advanced Lithography 2008, has ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...