BOISE, Idaho, March 03, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) today extended its leadership in low-power server memory by shipping customer samples of the industry’s ...
The new Micron HBM3E 12-Hi features an impressive 36GB capacity, which is a 50% increase over current HBM3E 8-Hi stacks, allowing far larger AI models like Llama 2 with 70 billion parameters to run on ...
We’re on the verge of a new era of computing that will likely see major changes to the data center, thanks to the growing dominance of artificial intelligence (AI) and machine learning (ML) ...
Smart memory node device from UniFabriX is designed to accelerate memory performance and optimize data-center capacity for AI workloads. Israeli startup UniFabriX is aiming to give multi-core CPUs the ...
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
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