Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

Samsung has reportedly hired a veteran semiconductor engineer who worked for its foundry arch-rival TSMC for almost two decades. Lin Jun-cheng will serve the Korean firm as the senior vice president ...

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced ...

Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

SK keyfoundry, an 8-inch pure-play foundry in Korea, has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor ...