Dublin, March 11, 2026 (GLOBE NEWSWIRE)-- The "Critical Materials for Power Module Packaging: Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" report has been added to ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Power electronics in the Industry 4.0 era are evolving to deliver higher efficiency and power density and simplify power design.

BorgWarner (BWA) to present its next-generation double-sided cooled (DSC) 800V SiC power module for high-current-density applications on May 16, 2025, at 9:00 am CET Expert-led virtual presentation ...

Kaynes Semiconductor is looking to expand into IC backend businesses as Kaynes Technologies' EMS business faces uncertainties due to US tariffs. India's Kaynes Semicon outlines OSAT roadmap from power ...

(MENAFN- GlobeNewsWire - Nasdaq) The report "Critical Materials for Power Module Packaging: Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging ...

AUBURN HILLS, Mich., April 29, 2025 /PRNewswire/ -- BorgWarner is set to showcase its latest technology at the 46th Vienna Motor Symposium from May 14-16, 2025, at the Hofburg in Vienna and will lead ...