Researchers have proposed process flow guides for 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet-engine ...

(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

With the Voxelfill strategy, voxel cavities (component contour and inner walls) are printed and then selectively filled with material. (Bauteilkontur – Component contour; Innenwände – Inner walls; ...

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...

The optimized component made of glass fiber-reinforced polyamide is represented here within the NX program with a weight-optimized lattice structure. Photo Credit, all images: Naddcon AIM3D GmbH ...

Researchers have developed a new laser-based process for 3D printing intricate parts made of glass. With further development, the new method could be useful for making complex optics for vision, ...

SUTD, SUSTech and ZJU researchers' proposed process flow guides 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in ...