TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading ...

High bandwidth memory (HBM) chips have become a game changer in artificial intelligence (AI) applications by efficiently handling complex algorithms with high memory requirements. They became a major ...

At the SK AI Summit 2025 in Seoul on November 3, 2025, SK Hynix CEO Kwak Noh-jung announced a major strategic overhaul, revealing plans to transform the South Korean memory maker from a traditional ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Micron has announced it's now shipping its fastest and highest-capacity high-bandwidth memory (HBM) yet, its second-generation HBM3, called HBM3e. The company's newest memory modules feature a record ...