The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
A new study uses shear tests and seepage-stress analysis in north China's Liushagang formation to create a model that predicts collapsing pressure and avoids costly drilling delays in hard, brittle ...
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