TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate ...
TL;DR: TSMC will start equipment installation at its largest CoWoS advanced packaging plant, AP8, in Southern Taiwan Science Park in April 2025, with completion by year-end. The plant will house ...
Hosted on MSN1mon
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacksTSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...
Hosted on MSN8mon
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodesTSMC is also optimizing its packaging technologies, particularly CoWoS-L and CoWoS-R ... enable HBM4 memory subsystems a few years down the road.
TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...
This new generation of TSMC's CoWoS â„¢ test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's ...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow recovery in ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback