The number and variety of test interfaces, coupled with increased packaging complexity, are creating an explosion of testing ...

With complexity of sub-90nm SOCs driving the need for test to be integrated throughout the design process, both of EDA’s largest vendors today introduced major upgrades to their respective offerings.

SecureIQLab today published its Cloud WAAP CyberRisk Validation Methodology v5.0, the first independent methodology to ...

Because electronic systems for all applications in end-user markets must provide the highest possible reliability to match customers’ quality expectations, semiconductor components undergo multiple ...

This chapter discusses helmet ballistic testing methodologies. It describes helmet design and suspension systems as well as current and proposed clay head forms used in the ballistic testing of ...

The variety of different test methodologies combined with today�s mixture of memory devices creates a complex test profile. The manufacturing test floor hums with activity; a range of memory devices ...

TOKYO, Sept. 23, 2020 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has announced its next-generation V93000 testers targeted at advanced digital ...

Among the first decisions to be made when initiating a composites testing program is the selection of test methods to follow. Unless performing highly customized testing, it’s usually not difficult to ...

Historically, testability is an afterthought in the design process. But heightening complexity of chip designs, and especially SoCs, forces testability (and manufacturability) to take a more central ...

A variety of threats lead to head injuries in the battlefield. Since World War II (WWII), the predominant threats have been: fragmentation and ballistic threats from explosions, artillery, and small ...