Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics ...

As of September 30, 2024 and September 27, 2023, ACM Shanghai’s total backlog amounted to RMB 6,764.6 million (USD $964.8 million), and RMB 6,795.8 million respectively. The total backlog figures ...

This is what 2.5D advanced packaging (CoWoS) looks like, with ASE showing off an incredible model in Taiwan of how the components are bound together.

Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication ...

In the last three months, 4 analysts have published ratings on Amkor Tech AMKR, offering a diverse range of perspectives from ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to ...

Chiplet Summit helps educate both design and packaging engineers. The advanced packaging tutorial covers methods such as 3D, ...

TSMC is capacity-constrained, but capex investments to alleviate these constraints are a positive for long-term growth. Learn ...

President Biden signed the CHIPS Act into law in August 2022 and called it a "once-in-a-generation" piece of ...

This company is "a unique play in Europe on the Nvidia/AI supply chain," Jefferies investment bank said in a research note.

About Rapidus Corporation: Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors ...