These technologies leverage wafer-level integration for miniaturization of components, leading to greater interconnection densities. Figure 2 Advanced packaging techniques like 2.5D and 3D improve ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

2.5D vs. fan-out Several advanced packaging types are in the market, such as 2.5D/3D and fan-out. Both types are moving toward more functions and I/Os, supporting larger and more complex dies. Fan-out ...

China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics ...

As of September 30, 2024 and September 27, 2023, ACM Shanghai’s total backlog amounted to RMB 6,764.6 million (USD $964.8 million), and RMB 6,795.8 million respectively. The total backlog figures ...

Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come ...

Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication ...

ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the launch of its Ultra C bev-p panel bevel etching tool ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to ...

ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced it has received purchase orders for four wafer-level ...

This company is "a unique play in Europe on the Nvidia/AI supply chain," Jefferies investment bank said in a research note.