At the Ignite developer conference today, Microsoft unveiled two new chips designed for its data center infrastructure: the Azure Integrated HSM and the Azure Boost DPU.
Microsoft's announcing chips to power workloads on Azure, including a hardware accelerator to offload and manage data processing tasks.
According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.
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