At the Ignite developer conference today, Microsoft unveiled two new chips designed for its data center infrastructure: the Azure Integrated HSM and the Azure Boost DPU.
According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback