The global tapes market is projected to grow from USD 86,381.4 million in 2025 to USD 140,706.3 million by 2035, registering ...

In this communication, we report on metal to glass anodic bonding for Microsystems packaging. Bonded Pyrex-Foturan/Metal double stack and Silicon/Pyrex/Metal triple stack were investigated for ...

Abstract: Direct bonding appear well suited for low temperature bonding provided that tuned chemical mechanical polishing (CMP) or plasma activation processes can be used on surfaces before wafer ...

One of the latest trends in clinching technology is the ability to process newer types of materials used in lightweighting ...

Introduction One of the primary growth drivers of the global cyanoacrylate adhesive market is the increasing demand from the consumer electroni ...

As hard as we try to avoid it, rust is an inevitable issue with all cars. Sometimes it is just cosmetic, but when it gets ...

and bonding these layers using heat, pressure, or adhesive. Constructing a high-voltage/current multilayer laminated bus bar requires that the layers be fully insulated yet function as a single ...