Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.

The ongoing viability of Moore's law is up for debate. But it seems Taiwanese megfab TSMC is determined to crank out new silicon regardless. The latest reports claim TSMC's next-gen 2nm chip node ...

In fact, TSMC customers (e.g., NVIDIA, and AMD) are scaling their AI and HPC workloads, while demand for CoWoS packaging is so strong that TSMC accelerated its capacity expansion from 2026 to 2025.

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at semiconductor ...

In a 2013 ITC paper [2], TSMC engineers described their test approach to assure “pretty good die” that worked within these constraints. First, they noted that power/ground signals are either a single ...

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

They predict that Taiwan Semiconductor Manufacturing Company’s (TSMC) CoWoS spending in the second half of 2025 and potential upside from High Bandwidth (NASDAQ:BAND) Memory (HBM), despite previous ...

The analysts emphasized ONTO’s strong exposure to AI-related growth, particularly in advanced packaging technologies like TSMC CoWoS and HBM. ONTO's reduced exposure to China is seen as a positive, ...