China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics ...

FREMONT, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication ...

This is what 2.5D advanced packaging (CoWoS) looks like, with ASE showing off an incredible model in Taiwan of how the components are bound together.

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to ...

In the golden glow of autumn, Shenzhen brings all together to convene a grand celebration. On September 27, the Third ...

These technologies leverage wafer-level integration for miniaturization of components, leading to greater interconnection densities. Figure 2 Advanced packaging techniques like 2.5D and 3D improve ...

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...