BlueLynx PHY solutions support Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project (OCP) Bunch of Wires (BoW) interfaces. An optional link layer connects to on-die ...

The once undisputed king of the chip market is on its knees. Here’s what it needs to do to get back on its feet.

The first Samsung Galaxy Unpacked of 2025 kicks off an exciting year ahead for Android phones and mobile AI. We're expecting ...

Qualcomm‘s latest flagship processor, the Snapdragon 8 Elite, is built using TSMC’s third-generation 3nm (N3E) process. It ...

UMC seeks to improve capital efficiency by requiring guarantee payments for customers who want to reserve capacity. The company has more than TWD 30 billion in customer prepayments on its books, which ...

The first Samsung Galaxy Unpacked of 2025 kicks off an exciting year ahead for Android phones and mobile AI. We're expecting ...

Recently exposed manifests reveal that Intel has begun shipping test samples of its next-generation server and desktop ...

Global semiconductor revenue is expected to slow to mid-single digits in 2025, which marks a steep fall from the 20% growth seen in 2024, according to a forecast by Susquehanna. Global wafer fab ...

The report found that the 10 leading semiconductor companies in the U.S., Europe, South Korea, Taiwan, Japan and China had an aggregate 2% decline year-over-year to $123.3 billion. In 2023, due to a ...

New details emerged about Samsung's XR headset at Galaxy Unpacked 2025. This Apple Vision Pro and Meta Quest 3 competitor is ...

As Samsung Electronics (Samsung) attempts to reshape the global memory market through its sixth-generation high bandwidth ...

Gorilla Armor 2 is a landmark achievement in glass ceramic technology, combining superior toughness with excellent clarity on a smartphone display.