Global chip sales up; Siemens’ shift-left tool; export controls’ impact; HBM3E/HBM4 roadmap; quantum in CAE; MIT’s breakthrough; ASE’s expansion in Mexico; advanced photonic IC pilot line; UK invokes ...

Three-dimensional (3D) integration has opened new possibilities for the development of denser circuits with more ...

Researchers at the University of Minnesota have achieved a new material that will be pivotal in making the next generation of ...

The president-elect has a record of reversing policies from prior administrations, but there are many reasons he might spare Biden’s program to boost domestic semiconductor manufacturing.

The impact of Donald Trump being elected president again will affect many aspects of our industry, with one of those being ...

The electronica 2024 trade show in Munich, Germany is just around the corner. It is one of the largest gatherings of ...

Industry learning expands as more SoCs are disaggregated at leading edge, opening door to more third-party chiplets.

Reports suggest that the forthcoming 11th-generation iPad may retain the design features of its predecessor ... could be achieved through an upgraded chip, potentially the A16, aligning with ...

(Pixabay) The majority of startups have failed to light up the chip design space. Of the roughly 60 proposals submitted to the ministry of electronics and IT (MeitY) by these companies to get the ...

When he fried and served them, instead of getting angry, the customer loved the unique design of the potato ... to stick to the chip’s surface, ensuring that it doesn’t fall off into the packet after ...

Nvidia CEO Jensen Huang said on Wednesday a design flaw with its latest Blackwell AI chips which impacted production has been fixed with the help of longtime Taiwanese manufacturing partner TSMC .