HBM4 is a little different to HBM3 and HBM3E: the manufacturing process for HBM4 differs to previous-gen HBM designs, as the ...

Each die is flanked by four blocks of high-bandwidth memory (hbm) chips that together store 192 gigabytes of data. The ...

Keep in mind that HBM solution consists of a stack of eight or 12, as Manish has discussed, memory die and then there is a base die, which is the logic die. And in that base die opportunity with ...

SK hynix Inc., the world's second-largest memory chipmaker, is developing next-generation high bandwidth memory (HBM) ...

Data movement is becoming a bigger problem at advanced nodes and in advanced packaging due to denser circuitry, more physical ...

To that extent, HBM is a memory part. The functionality of the memory part tends to be more constrained than a logic piece. We’re going to have ... we’re trying to standardize a die-to-die interface, ...

The HBM Gen2 PHY – delivered as a fully characterized hard macro – includes all necessary components for robust operation, such as IO pads, PLL, clock distribution, transmit and receive paths, control ...

The high-bandwidth memory (HBM) market for servers is transitioning ... Samsung will reportedly create the logic dies for ...

Logic Design Solutions launches a new version of its NVMe HOST ... extending its market leadership in HBM IP with broad ecosystem support. CAST Ships I2C/SPI Controller IP Core for Easier Serial ...