SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute Express Link (CXL) ...

MultiDimension Technology Co., Ltd. (MDT), a global leader in magnetic sensors specializing in Tunneling Magnetoresistance (TMR) technology, introduces its groundbreaking TMR2615/ TMR2617 series at ...

CUDIMM is the latest development in RAM technology, and it comes with some exciting upgrades of standard UDIMM memory.

In our benchmark tests, it traded top scores with the SK Hynix Beetle (our runner-up ... are the premium pricing and a general lack of compatibility with the far more popular USB.

It's also backwards compatible with USB 3.0 and USB 2.0 if ... 20-82-10023 controller and SanDisk BiCS 4 96L 3D TLC flash memory. During our benchmarking with CrystalDiskMark, the drive reached ...

Lexar recently introduced its latest product lineup in Malaysia, showcasing its innovative memory solutions under the theme ...

In an industry-first, SK hynix has announced its 16-Hi HBM3E memory, offering capacities of 48GB per stack alongside other bleeding-edge NAND/DRAM products.

FREMONT, Calif., Nov. 16, 2024 /CNW/ -- Today, TetraMem Inc ( www.tetramem.com) & SK hynix Inc ( www.skhynix.com) announced that they have signed an SOW outlining their partnership on a joint research ...

with HBM memory share of DRAM revenues for SK hynix in Q3 2024 hitting 30% and forecasted to reach 40% in Q4 2024 (especially as NVIDIA's new Blackwell B200 and GB200 are now in the wild with the ...