FREMONT, Calif., Nov. 16, 2024 /CNW/ -- Today, TetraMem Inc ( www.tetramem.com) & SK hynix Inc ( www.skhynix.com) announced that they have signed an SOW outlining their partnership on a joint research ...
Samsung reportedly started HBM4 development, with a rumor that it's working on 'custom HBM4' memory solutions for Meta and ...
South Korea's thriving AI industry has catalyzed growth across its materials, components, and equipment sectors, particularly ...
Nvidia is gearing up to debut its next-gen "Rubin" GPU in 2025, featuring eight HBM4 chips, with a Rubin Ultra version to ...
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Top Samsung rival unveils “world’s largest capacity” 16-Layer HBM3e chips — SK hynix promises boosted performance for allSk hynix claims SK hynix has announced plans to add an additional four layers to its 12-HI HBM3e memory chips in a drive to ...
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