Li, Chonghe Soh, Kitty Chi Kwan and Wu, Ping 2004. Formability of ABO3 perovskites. Journal of Alloys and Compounds, Vol. 372, Issue. 1-2, p. 40.
Modern integrated microelectronic devices are often poorly repairable and difficult to recycle. Debondable adhesives play a key role in the transition to a circular economy with sustainable resources, ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film.