Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

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Abstract: Sparse reconstruction techniques have been recognized as an effective method for improving the estimation accuracy of direction-of-arrival (DOA). However, existing studies have primarily ...

Company earns top ranking from world’s largest software marketplace, backed by industry-leading satisfaction for AI-powered low-code development platform “OutSystems customers are leading among their ...