Singapore, Micron Technology and AI

MICRON Technology on Wednesday (Jan 8) broke ground in Woodlands for an advanced packaging facility for its high-bandwidth memory (HBM) semiconductor chip. Read more at The Business Times.
Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.
Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...
It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...